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Winbond

(竹北/台中) 光罩工程師

Winbond
Hong Kong
2-4 Years
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  • Posted 10 hours ago
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Job Description

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1.Tape-out
2.
3.

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1.Linux
2.EDA tool(Virtuoso, Calibre, Klayout)
3.
4.Programing (Python, Perl, Tcl, C#, ASP.Net...)
5.

#LI-LL1

More Info

Job Type:
Permanent Job
Industry:
Electronic Components/Semiconductors
Function:
Engineering
Employment Type:
Full time

About Company

Winbond

Job ID: 143399077

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Last Updated: 24-02-2026 09:44:21 PM
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