Staff Product Test Engineer (PTE)

JOB PURPOSE

The Staff Product Test Engineer (PTE) will lead and approve the release-to-manufacturing of FT ATE (final test automated test equipment) solutions at OSATs (Outsourced Semiconductor Assembly and Test houses) for the MP (mass production) of semiconductor MEMS and ASIC products.

The Staff Product Test Engineer (PTE), who will work closely and collaboratively with the Engineering team responsible for the development of the FT ATE solution, will provide guidance on the deliverables required for the approval and release to OSAT, including test cost, tester and OSAT selection, test limits, yield requirement, gauge R&R, bench-to-ATE correlation, etc.

This position plays a pivotal role in the testing phase of product development, from new product introduction (NPI) to high-volume manufacturing. The responsibilities for this role span technical leadership, project management, team management, and cross-functional collaboration. The Staff Product Test Engineer (PTE) will report directly to the Director of Operations - Asia and will be expected to work a total of 40 hours per week.

RESPONSIBILITIES AND DUTIES

Test Program Release & Deployment

• Define engineering requirements specification (ERS) including test coverage, test time, and cost targets to enable test program development by engineering
• Release high quality test programs to production based on correlation, yield, and stability
• Deploy test solutions at OSAT and own the bring-up
• Maintain test program release process and regression testing
• Coordinate tester/prober sourcing and consignment requirements at OSAT

Production Ownership

• Analyze production data to identify test/yield improvement opportunities
• Data driven analysis to inform engineering/vendor test improvements
• Validate test program changes and manage deployment at OSAT
• Debug deployment issues (e.g. equipment problems, correlation drift)
• Own field quality metrics and customer RMA resolution including corrective actions
• Make disposition decisions based on test results (scrap/hold/rework)
• Drive OSAT OEE (overall equipment effectiveness) improvement and cost reduction

Data Infrastructure & Analysis

• Set up production data systems (e.g. Galaxy) for yield monitoring
• Build infrastructure for parametric trends, yield paretos, corner analysis
• Generate control charts and early warning systems
• Support MEMS wafer map analysis and release decisions

Cross-functional Interface

• Work closely with engineering to validate test program vs specs
• Translate production reality back to engineering based on data
• Manage OSAT relationship for test-related issues
• Define and enforce LAT (Lot Acceptance Testing) process

REQUIRED SKILLS

• BS in Engineering or equivalent with 10 years of experience
• Be able to transfer a test solution from one platform to another
• Strong background in analog and digital final testing and test solutions
• Excellent understanding of different measurement resources in different test platforms and how they are used for analog and digital precision measurements
• Excellent programming skills with different Test Platforms
• Have an understanding of mixed-signal circuits and signal processing
• Experience with ATE release/deployment to OSAT for mass production
• Experience with ATE test limit definition, guard band, TTR (test time reduction), gauge R&R, correlation bench-to-ATE, binning
• Experience sustaining FT ATE in production, yield monitoring, improvement and optimization.
• Experience with customers RMA, traceability, root-cause analysis, 8D reports, lot disposition
• Excellent interpersonal, coordination, and communication skills to lead projects across engineering, operations, and suppliers
• Comfortable with confrontation, drive internal and external negotiations (e.g. acceptance criteria with Engineering team, limits and yield definition with OSAT, etc.)
• Proficiency in data analysis and coding skills (e.g., JMP, Python, Matlab or similar) for yield, product, and cost optimization.
• Familiarity with quality tools such as 8D, fishbone diagrams, 5 Whys, PPAP, and PFMEA.
• Ability to work effectively across different global time zones.

DESIRED SKILLS

• Experience with both single-component testers and wafer-level FT (CSP CoW - chip-scale package chip-on-wafer)
• Experience with FT temperature calibration at cold, room, and hot
• Experience with 2-dies component (MEMS + ASIC)
• Experience with multiple package types, e.g. ceramic, plastic, CSP
• Experience with timing/frequency/oscillator device testing

WORKING CONDITIONS

• Hybrid work environment, combining both remote work and on-site presence as needed to fulfill job responsibilities.

WHAT SUCCESS LOOKS LIKE

• Test programs release to production without crisis
• Urgent OSAT calls get resolved without waking engineering
• Yield improves quarter-over-quarter
• Customer RMAs receive prompt root cause analysis
• Engineering and operations share data and collaborate effectively