Summary
At Apple, we believe our products begin with our people. By hiring a team with varied strengths, we drive creative thought. By giving that team everything they need, we drive innovation. By hiring incredible engineers, we drive precision. And through our collaborative process, we build memorable experiences for our customers.
These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Will you help us design the next generation of revolutionary Apple products
Description
We are looking for a senior level advanced packaging engineer to develop exciting new products. Your role is to interface between internal product/device design, process integration and external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.
Responsibilities
- Explore and evaluate packaging technologies as our own packaging tool box. Define new package characteristics and specification based on unique module and system level performance, cost, and footprint.
- Work with leading foundry & assembly suppliers on advanced organic and silicon interposer interconnect package development from design, new material, new equipment selection and establish robust process of record. Perform initial proof of concept sample build, test vehicle validation, package and process qualification, yield and continuous improvement.
- Interface and coordinate with other packaging team members to comply with product development & ramp schedule. Deliver product milestones on time.
- Define packaging roadmap based on long term package product requirements. Work closely with suppliers and manage R&D activities.
- At least 510% travel to domestic and international locations.
Minimum Qualifications
- M.S or Ph.D. degree in mechanical engineering, physics, materials science or similar disciplines with a minimum of 5 years of experience in advanced SoC packaging.
- In-depth knowledge in large body size MCM package technologies inclusive of SoC & Memory integration, RDL/silicon interposer and Chip-on-Wafer processes.
Preferred Qualifications
- Good understanding to organic package process & material characterization such as micro bump plating, RDL lithography, molding compound and under-fill. Knowledge in heterogenous 2.5D/3D integration, advanced node process and device physics or component/board level reliability testing are plus.
- Proven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
- Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at internal or external meetings.
Apple is an equal opportunity employer that is committed to inclusion and diversity, and thus we treat all applicants fairly and equally. Apple is committed to working with and providing reasonable accommodation to applicants with physical and mental disabilities.
