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Job ID: 145255113
Skills:
Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, System-in-Package SiP, Warpage characterization, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans
Skills:
Ipv4, Linux, ROS, Ipv6, Network Protocols, embedded ARM processors, Adaptive Autosar, real-time operating systems
Skills:
container , Unix, Logging, Prometheus, Ldap, Windows, Grafana, Teamcity, Python, AWS, virtualization, Ssh, Jenkins, Git, Shell Scripts, Gcp, Linux, Ansible, Rest Apis, Azure, Kubernetes, Go, alerting, remote access, AI-assisted development tools, Active Directory, Monitoring, cloud environments, microservices architecture
Skills:
semiconductor test processes, ATE equipment, test programming, ATE test methodology
Skills:
Javascript, C, Linux, Windows, Python, statistic software, Jmp