Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, System-in-Package SiP, Warpage characterization, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans

Ipv4, Linux, ROS, Ipv6, Network Protocols, embedded ARM processors, Adaptive Autosar, real-time operating systems

container , Unix, Logging, Prometheus, Ldap, Windows, Grafana, Teamcity, Python, AWS, virtualization, Ssh, Jenkins, Git, Shell Scripts, Gcp, Linux, Ansible, Rest Apis, Azure, Kubernetes, Go, alerting, remote access, AI-assisted development tools, Active Directory, Monitoring, cloud environments, microservices architecture

semiconductor test processes, ATE equipment, test programming, ATE test methodology

Javascript, C, Linux, Windows, Python, statistic software, Jmp

Metrics scraping and alerting ecosystems, SIEM operations and detection engineering, Telemetry collection frameworks and instrumentation standards, SOAR or automation orchestration platform, Log collection and routing architectures, Detection rules or correlation logic for security monitoring, Linux systems fundamentals, Supply chain security concepts, Columnar or analytical databases for log trace event storage, Production experience deploying and operating on Kubernetes or equivalent container orchestration platforms, Container security scanning and software composition analysis tooling

oracle linux , Network - Routing and Switching, Microsoft Active Directory, Linux, Red Hat Enterprise Linux, Windows Server 2019, Red Hat OpenShift

Nas, Network Monitoring, Diameter, Kubernetes, PFCP, Packet Core nodes, AI Literacy, Cloud-native environments, Machine learning insights, Predictive Maintenance, GTPV2, 5GC, 4G and 5G Core network troubleshooting, U, Epc, SIP, Call flow analysis, HTTP 2