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Job ID: 152400231
Skills:
Semiconductor Industry, Project Management, Analytical and Problem-Solving Skills, Engineering, Quality Management, Productivity Improvement, Process Engineering, yield, Liaising with cross functional teams, Process Support, Project Coordination
Skills:
Fmea, Product Design Development Cycle, Control Plan, quality engineering, Six Sigma
Skills:
Underfill dispensing and curing processes, Flip Chip Packaging, Process characterization and optimization, Semiconductor packaging fundamentals, 2.5D 3D Packaging, DOE and statistical analysis, Failure analysis methodologies, Root cause analysis methodologies, System-in-Package SiP, Warpage characterization, Material characterization techniques, Yield improvement techniques, SPC FMEA Control Plans
Skills:
cmo management , Quality Assurance, test plans for components materials and systems, plastic engineering, manufacturing processes methodologies, wafer fabrication, biochemistry process, Process Control, failure analysis of multiple reliability failure modes
Skills:
SAP, Data Analysis, Fmea, Ms Office Applications, Quality Tools, Control Plan