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Winbond

(?? / ??) SAP Budget/Subcon ?????

Winbond
Early Applicant
  • Posted a month ago
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5-7 Years
Hong Kong

Electronic Components/Semiconductors

Job Description

( / ) SAP Budget/Subcon


1. Budget/Subcon
2.
3.
4.
5.

(.539)





5

No
No

No

1. Budget Management Subcontractor
2. API Web Services
3.
#LI-LL1

More Info

Industry:Electronic Components/Semiconductors

Function:Information Technology

Job Type:Permanent Job

Date Posted: 27/08/2025

Job ID: 124887701

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Winbond
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Last Updated: 30-09-2025 10:58:24 PM
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