PVD Module Engineering Manager

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the worlds largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Role:

1. Lead new technology transfers, production line set up / maintenance, team establishment, quality / productivity improvement to ensure the whole production process smoothly.
2. Elevate Engineering and Manufacturing excellence in PVD field.

Job Responsibilities:

1. Module process / equipment fundamental improvement.
2. Innovate and seize opportunities for wafer quality / productivity improvement.
3. Work with Process integration / Manufacturing / Yield improvement / Cross module team to sustain high quality wafer production / delivery.
4. Proactively identify talent and continuously develop team members with a deliberate roadmap.
5. Sustain ownership of day-to-day operations, equipment troubleshooting and mentoring engineers, Resources planning, task prioritization, and related cross-function management work.

Job Qualifications:

1. Minimum of a Masters Degree in an engineering and scientific field such as Materials Science, Electrical Engineering, Chemical Engineering and Mechanical Engineering.
2. Minimum 8 years of experience in the semiconductor field, especially in module process development.
3. Experience in the semiconductor industry with PVD (including CVD and ALD chamber types) process and equipment knowledge.
4. Solid technical understanding of IC processing equipment, integrated flow, chemistry and physics.
5. Be able to work within cross-functional teams, including internal and external partners.
6. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
7. Flexibility to change priorities and responsibilities to support business needs.
8. Hands-on participant with a strong sense of ownership.
9. Willing to work in clean room.

Personal Attributes:

1. Must be a self-starter, highly organized, and able to work well across organizations.
2. Polished presentation and interpersonal skills.
3. Good at Mandarin and English communication.

Thank you for your interest in TSMC. We sincerely appreciate your job application. Should your qualifications be a good fit, we will be in touch within one month to discuss the next steps in the hiring process.