Project Manager – MEMS Packaging Development

We are seeking a motivated and technically skilled Project Manager to support the development of innovative MEMS sensor products.

Key Responsibilities

- Define & drive milestones: Establish major packagedevelopment milestones and ensure on-time delivery through proactive planning, progress tracking, and risk mitigation.

- Design coordination: Coordinate package design and process development for electronic MEMS sensors in collaboration with internal engineering teams and external suppliers.

- Process engineering: Develop and optimize assembly processes for MEMS in automotive and consumer-electronics applications.

- Sample build & qualification: Oversee sample manufacturing and process qualification at assembly partners.

- Cross-functional collaboration: Communicate and work effectively in English with international stakeholders across product engineering, supply chain, and quality teams.

Qualifications

Requirements

- Experience: 38 years in semiconductor packaging/assembly (LGA, BGA, DFN, WLCSP).

- Technical expertise: Strong background in semiconductor assembly technologies and materials.

- Project management: Proven ability in milestone tracking, reporting, systematic problem solving, multi-task handling and customer communication.

- Global teamwork: Demonstrated success in multicultural, international projects.

- Adaptability: Agile in adjusting project plans to evolving technical requirements and customer needs.

- Language & mobility: Excellent English skills (verbal and written); willingness to travel as required.

Please apply via below link:

https://smrtr.io/sTSyg