Provide technical support for new product introduction at subcons, ensuring that technical, quality, schedule, and cost requirements are achieved.
Your Role
Key responsibilities in your new role
- Provide technical support for new product introduction at subcons, ensuring that technical, quality, schedule, and cost requirements are achieved.
- Responsible for technical support of new product, package, module, or new process development together with subcontractors.
- Ensure that the project meets customer requirements in terms of timeline, cost, and quality.
- Assess and mitigate technical and manufacturability risks.
- Provide design and concept proposals for package, substrate, and modules for new products. And through this contributing to new concept innovation and intellectual property (IP) generation activities.
- Close interaction with the project manager, subcon interface, chip designer, application team, marketing, and business units for new product design and project roadmaps.
- Provide technical direction related to problem-solving of process and reliability issues.
- Technical Documentation through Delta analysis, DFMEA, PFMEA, Process Flow, and Control plan
- Closure of Package Development related deliverables and documents.
Your Profile
Qualifications And Skills To Help You Succeed
- a Master degree / Diploma in Materials Science, Physics, Process Engineering or an equivalent technical related course of study
- a minimum of 5 years of experience working on chip embedding, PCB or IC substrate manufacturing and/or panel level packaging
- a thorough understanding of PCB technologies, design, materials, and manufacturing processes
- experience in lamination, via formation, plating, patterning, etching, drilling and routing processes. Experience of chip embedding technologies would be highly beneficial
- An understanding of PCB reliability. Knowledge of power semiconductor devices and interaction with device packaging is ideal but not essential
- Experience on EMS board assembly and assembly technologies and the impact to product concept and design
- Understanding and experience in design-for-manufacturing for module assembly
- the willingness for business travel
- excellent skills in written and spoken English; Chinese skills are a plus
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in
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This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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