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Winbond

(?? / ??) MM ???????

Winbond
Early Applicant
  • Posted a month ago
  • Be among the first 10 applicants
5-7 Years
Hong Kong

Electronic Components/Semiconductors

Job Description

( / ) MM


1.
2.
3.

(.539)




5

No
No

No

[]
1. Must Have
(1) C#.NET Core
(2) Vue3
(3) SQLCRUDJoinIndex
(4)
(5)

2. Nice to Have

(1)
(2)
(3) AzureAWS
(4) CI/CD GitHub Actions
(5) Microservices
(6) xUnitJestVue Test Utils
(7) APIAzure APIGoogle API

#LI-LL1

More Info

Industry:Electronic Components/Semiconductors

Function:Information Technology

Job Type:Permanent Job

Date Posted: 27/08/2025

Job ID: 124888919

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About Company

Winbond
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Last Updated: 02-10-2025 10:27:43 PM
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