Google welcomes people with disabilities.
Minimum qualifications:
- Bachelor's degree in Mechanical Engineering or equivalent practical experience.
- 5 years of experience in microelectronics packaging (e.g., multi-chip modules, silicon photonics).
- Experience in thermomechanical reliability prediction, mechanical drop/shock simulation.
- Experience with Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) and programming languages Ansys (APDL, Workbench, Icepak).
Preferred qualifications:
- Experience with statistical software tools such as Flotherm, Abaqus, Matlab, Python.
- Experience in performing risk assessments based on failure data and incomplete information.
- Experience working in cross-functional engineering teams including internal and external organizations.
- Experience with test vehicles and experimental validation of simulation models.
About The Job
The AI and Infrastructure team is redefining what's possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.
We're the driving team behind Google's groundbreaking innovations, empowering the development of our AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.
Responsibilities
- Partner with key stakeholders internally and externally to develop numerical models evaluating and assessing manufacturing and reliability trade-offs.
- Develop scalable numerical models to capture different failure modes and physics phenomena expected during the entire microelectronics device life-cycle such as design, testing, assembly, test, field operation.
- Partner with thermal, packaging, test, manufacturing, quality and reliability engineers to develop validated simulation based design guidelines to ensure rapid and reliable deployment of microelectronics assemblies.
- Execute test vehicles to generate experimental data for model validation and enhancement.
- Participate in the development of roadmaps of materials, models and infrastructure required to scale numerical models in local and cloud based simulation environments. Attend conferences, standards bodies and other industry forums to keep up-to-date developments in numerical analysis.
Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google's EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form .
