Role Overview
We are seeking a high-energy, hands-on Process Engineer to join our manufacturing team. This role is critical in developing and optimizing high-volume Surface Mount Technology (SMT) processes that meet rigorous reliability and performance standards. You will be responsible for the end-to-end health of our assembly lines, from initial programming and profiling to advanced statistical process control and design for manufacturability (DFM).
Key Responsibilities
- Process Development: Design and implement SMT processes tailored for high-volume manufacturing, ensuring all high-reliability and product performance requirements are met.
- Continuous Improvement: Drive measurable improvements in process capability ($C_pk$) by utilizing Statistical Process Control (SPC) and structured problem-solving methodologies.
- Failure Analysis: Identify failure mechanisms in SMT materials and assembly processes. Formulate and execute rapid-response solutions to improve yield, reliability, and manufacturability under tight deadlines.
- Technical Programming (Hands-on): Directly create and optimize programs for solder paste/flux printing, Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and thermal reflow profiling.
- Cross-Functional Collaboration: Partner with Design, Quality, and Operations teams to ensure new products are optimized for production.
- DFM Reviews: Lead and participate in Printed Circuit Board (PCB) design reviews with a focus on Design for Manufacturability (DFM).
Minimum Requirements
- Education: BS in Mechanical, Chemical, or Industrial Engineering.
- Experience: 5+ years of direct experience in Surface Mount Technology (SMT),
- Technical Proficiency: * Deep understanding of high-volume SMT equipment, materials, and world-class assembly standards.
- Expertise in Minitab (or similar statistical software) and advanced Excel.
- Proven track record of improving yields, throughput, and Cpk in a production environment.
- Practical Skills: Demonstrated ability to create printing programs, SPI/AOI programs, and reflow profiles.
- Methodologies: Strong knowledge of SPC, Design of Experiments (DOE), and Six Sigma tools (FMEA, Control Plans) to prevent and solve technical issues.
- Soft Skills: Independent, creative thinker who thrives in a fast-paced environment; excellent written and verbal communication skills.
- Preferred: Experience with ASM Siplace Pick and Place equipment is a plus.
