Etching Module Engineering Manager

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the worlds largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Role:

1. New technology process transfer and matching to ensure successful Fab ramp to high volume manufacturing (HVM).
2. Responsible for new tool installation / qualification / sustain in a green field Fab and rapidly deploy fleet to meet wafer output commitment.

Job Responsibilities:

1. Advanced module process improvement and development.
2. Work with process integration team to develop high quality process technology.
3. Advise and plan for future technology roadmaps.
4. Resources planning, task prioritization, and related cross-function management work.

Job Qualifications:

1. Masters (10+ years exp.), or Ph.D. (4+ years exp.) in an Engineering or Physics-related field.
2. Experience in silicon wafer process, device, product, yield process development or HVM.
3. Experience in silicon semiconductor manufacturing and development with exposure and understanding of 22nm technology or below.
4. Advanced operations and program management experience.
5. Previous experience in IDM/Foundry (logic or memory) is preferred.
6. Direct people management experience required for people management positions.
7. Significant hands-on experience in technology development and technology transfer required.
8. Motivated self-starter, with strong ability to work independently as well as in a team environment.
9. Good at Mandarin and English communication
10. Demonstrated experience working with external and internal partners, including leading edge semiconductor equipment and/or materials manufacturers.
11. A fast learner, able to adapt to different cultures and technology
12. Flexibility to change priorities and work hours to support business needs

Personal Attributes:

1. Must be a self-starter, highly organized, and have an ability to work independently across organizations.
2. Demonstrated ability to communication complex problems through presentations and use of interpersonal persuasive skills.
3. Must possess top-level business management, interpersonal, and facilitation skills.
4. Desire for and demonstrated skill in leading and developing of persons and teams.

Thank you for your interest in TSMC. We sincerely appreciate your job application. Should your qualifications be a good fit, we will be in touch within one month to discuss the next steps in the hiring process.