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Winbond

(??)EAP/EES???

Winbond
Early Applicant
  • Posted 23 days ago
  • Be among the first 10 applicants
1-3 Years
Hong Kong

Electronic Components/Semiconductors

Job Description

()EAP/EESIT
EAP/EES SEMI Standard

[Responsibilities & Tasks]
1. (EAP) EES (FDC, R2R, RMS ...)
2.
3.
4.

[Requirements]
1. EAP/EES
2. C# SQL
3. AngularASP.Net MVC
4. UML
5. Git
6.
7. On Call
8.



1

No
No

No

More Info

Industry:Electronic Components/Semiconductors

Function:Manufacturing/Automation

Job Type:Permanent Job

Date Posted: 09/09/2025

Job ID: 125842689

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Winbond
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Last Updated: 02-10-2025 10:27:47 PM
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