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Winbond

(??)CMP?????

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  • Posted a month ago
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3-5 Years

Electronic Components/Semiconductors

Job Description


()CMP

  1. CMP&SDS
  2. 6S
  3. (FAB)



No
Yes

No

  1. 312CMP
  2. 3D IC Grinding/Trimming /Bonder/debond
  3. ,

(.10..35)

#LI-KK1

Date Posted: 27/08/2025

Job ID: 124887105

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Last Updated: 02-10-2025 10:27:49 PM