
Search by job, company or skills
Position Summary
Process Associate Engineer is responsible to support the engineering activities as well as the daily production activities reliably and efficiently.
Candidates with related experience in semiconductor and/or electronics manufacturing industry are encouraged to apply for this position.
Responsibilities:
Requirements:
Job ID: 150630635
Skills:
Microsoft Office, Spc, Laser-grooving, Backgrind, Dicing, Die Preparation
Skills:
ocap, encapsulation, CQM, ISO14001 2004, wire bond, Fmea, Spc, ESEC ASM KNS wire bonders, IC assembly processes, ISO9001 2000, structural substrates, testing machinery, encapsulant epoxy, die attach, material science of bonding wires, Doe, JEDEC, QEMS
Skills:
Microsoft Office, Excel
Skills:
Microsoft Office, basic hand tools, 5S principles, Lean Manufacturing, ESD best practices, workshop equipment
Skills:
promis , klarity , Rms, Ts16949, Ace, Spc, Si-View, cip, Ms Office Applications, 8D, Cp, Jmp, ECN, Space, Doe, TECN, SPSR, Cpk, metrology tools, mrb