Microsoft Office, Spc, Laser-grooving, Backgrind, Dicing, Die Preparation

ocap, encapsulation, CQM, ISO14001 2004, wire bond, Fmea, Spc, ESEC ASM KNS wire bonders, IC assembly processes, ISO9001 2000, structural substrates, testing machinery, encapsulant epoxy, die attach, material science of bonding wires, Doe, JEDEC, QEMS

Microsoft Office, Excel

Microsoft Office, basic hand tools, 5S principles, Lean Manufacturing, ESD best practices, workshop equipment

promis , klarity , Rms, Ts16949, Ace, Spc, Si-View, cip, Ms Office Applications, 8D, Cp, Jmp, ECN, Space, Doe, TECN, SPSR, Cpk, metrology tools, mrb