Position: Director of Application Engineering
Location: Taoyuan, Taiwan
Position Summary
The Director of Application Engineering is a senior technical leadership role responsible for defining and driving global application engineering capabilities in the high-performance electronics industry.
This position leads a team of technical experts and serves as a key decision-maker in PCB stack-up architecture, materials selection, signal integrity, thermal performance, and qualification strategies.
Key Responsibilities
Technical Leadership & Decision Making
- Provide technical direction and final approval on complex PCB stack-up designs, material choices, and performance trade-offs.
- Guide technical risk assessment and ensure design solutions meet reliability, manufacturability, and performance targets.
- Act as the senior technical authority during critical design-in and escalation situations.
Application Engineering Strategy
- Define and execute the global application engineering roadmap aligned with product strategy and future technology trends.
- Drive standardization of design methodologies, simulation practices, and qualification approaches across regions.
- Influence product development by translating field and customer technical needs into actionable technical requirements.
Cross-Functional Collaboration
- Partner with R&D, Product Management, Manufacturing, and Sales to align on technical capabilities and development priorities.
- Support new material and technology introductions through early technical evaluation and validation planning.
- Ensure seamless technical communication between internal teams and external partners.
Team Leadership & Talent Development
- Lead, mentor, and develop a global team of application engineers and technical specialists.
- Build technical depth, problem-solving capability, and succession planning within the organization.
- Establish scalable processes for stack-up modeling, simulation, testing, and failure analysis.
Technology & Industry Engagement
- Maintain deep expertise in advanced PCB materials, including high-speed, low-loss, and thermally enhanced solutions.
- Represent the company in industry standards committees and technical forums.
- Stay ahead of emerging technologies, industry standards, and qualification requirements.
Qualifications & Experience
- 15+ years of experience in application engineering, design engineering, or materials engineering within high-reliability electronics industries.
- Proven experience working with global PCB or laminate manufacturers and advanced interconnect technologies.
- Strong understanding of industry qualification standards, reliability testing, and failure analysis methodologies.
- Demonstrated ability to lead technical teams and influence cross-functional stakeholders.
Education
- Bachelor's degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical discipline.
To apply it, please send me your resume to [Confidential Information]
