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Winbond

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3-5 Years

Electronic Components/Semiconductors

Job Description


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Flash defect
1. defect inspection
2. Defect improved Project handle
3. Defect / yield analysis and data collection , Defect classify by DTCM/AI function.



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3

No
No

No

1.3defect

2.

3.

4.

Date Posted: 27/08/2025

Job ID: 124888167

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Last Updated: 02-10-2025 10:27:30 PM