analog mixed-signal devices, bench debug, ATE bring-up, semiconductor assembly and test processes, Silicon Characterization, ATE hardware development, load board interface board design, bench-level troubleshooting

3d packaging , Statistical Analysis, quality control statistics, substrate package design, chip assembly equipment design, materials process, Flip Chip semiconductor packaging design, OSAT management, Process Control, DOE techniques, data visualization techniques, project management

Pi, yield analysis, wafer-level statistics, Spc, Pe, Npi, Manufacturing Engineering

UltraFlex test handler, yield analysis, Adventest 93K, quality management tools, debug skills, Test Development, wafer prober