Matlab, Data Analysis, Minitab, thermocompression bonding, flip chip die attach, Jmp

Data Analytics, Visual Basic, Dashboarding, Python, Sql, R, Spc, E3 FDC, Doe, defect analysis, RMS Recipe Management System

Matlab, SOP technical documentation, Data Analysis, Process Optimization, Doe, Semiconductor front end, Hybrid bonding, Jmp, MS-Office

SAP, Spss, Ms Office, MATLAB, Process Control Software, Teamcenter, Statistics

SAP, Contract Negotiation, CAPEX procurement, ERP systems

Fmea, plasma cleaning, reflow, finite element simulation, Jmp, underfill curing, pick place, structured 8D problem-solving tools, Minitab, TCB, NCP flux-less flow, flux engineering, SPC controls

Project Management frameworks, SAP AMS support operations, SAP Activate methodology

die attachment, iso standards, wire bonding, eutectic die attach, semiconductor assembly and packaging process, Quality Control, wafer cleaving, process improvement