Search Jobs

Search by job, company or skills

Winbond

(??)?????????????

3-5 Years

Posted a month ago
Be among the first 10 applicants

Job Description

()

1.3DIC
2. (Hybrid bonding)
3.
4.3DIC
5.

()
3

No
No

No

1. 3DIC
2. Hybrid bonding
3. Thermal and Stress simulation
4.

More Info

Job Type:

Industry:

Electronic Components /Semiconductors

Function:

Employment Type:

About Company

Winbond

Job ID: 143941265

Jobs by Skill - IT

Jobs by Skill - Non IT

Jobs By Role

International Jobs

Last Updated: 23-08-2026 08:30:13 PM

Homejobs in Hong Kong(??)?????????????

Beware of Scammers

We don’t charge money for job offers