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Winbond

Hong Kong

3-5 Years

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Posted a month ago
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Job Description

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(1) Discuss with designer during product development.
(2) Define Probe Card SPEC.
(3) Simulate product function before tape out.
(4) Test PGM development and innovation by Advantest T5833 / T5377s
(5) Verify new product circuit.
(6) Process failure model analyzation.
(7) Test PGM release.

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2. Advantest ATL , C# , VBA
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