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Winbond

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Winbond
Hong Kong
4-6 Years
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  • Posted 2 months ago
  • Be among the first 10 applicants
Early Applicant

Job Description

(1)Wafer level(TDDB/HCI/NBTI/EM/SM)
(2)//
(3)
(4)
(5)()
(6)(MRB)/(PCRB)
(7)
(8)



4

No
No

No

1.Wafer level,TSVInterposerHybrid bond
2.
3.
4.

More Info

Job Type:
Permanent Job
Industry:
Electronic Components/Semiconductors
Function:
Semiconductor
Employment Type:
Full time

About Company

Winbond

Job ID: 124888945

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Last Updated: 17-04-2026 04:43:25 AM
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