About the Role
The Vice President of Manufacturing Engineering is an executive responsible for leading all manufacturingfacing engineering functions across semiconductor products, with ownership of advanced packaging, test engineering, process engineering, product engineering, reliability assurance, and new product introduction (NPI). This role bridges design, manufacturing, and quality, ensuring smooth product transitions from development to highvolume production. The VP of Engineering is accountable for yield, quality, reliability, cost optimization, and manufacturability, while serving as a key executive interface to foundries, OSAT partners, and strategic customers, particularly for ASIC and custom silicon programs.
Responsibilities
- Engineering Functions Under Management
- Package Engineering (advanced & traditional)
- Test Engineering (ATE, probe, final test, yield improvement)
- Process Engineering (wafer, backend, assembly/test processes)
- Product Engineering (yield, debug, characterization)
- Reliability Assurance (RA) & qualification
- New Product Introduction (NPI) & ramp to volume
Key Responsibilities
- Define and execute the engineering strategy supporting manufacturing excellence, scalability, and longterm technology roadmap
- Build and lead a worldclass engineering organization with strong technical depth and disciplined execution
- Establish engineering KPIs covering yield, quality, cost, reliability, cycle time, and timetomarket
- Develop engineering talent, succession plans, and technical leadership bench strength
- Own package architecture strategy including advanced packaging (e.g. SiP, 2.5D/3D, FC, WLCSP as applicable)
- Drive backend process development, optimization, and transfer to OSAT partners
- Lead process window definition, risk identification, and manufacturability improvements
- Work closely with design teams to ensure DFM/DFT/DFP alignment early in product development
- Lead test strategy across wafer probe, final test, and systemlevel test
- Oversee test coverage, cost optimization, throughput improvement, and yield enhancement
- Drive root cause analysis and corrective actions for yield excursions
- Ensure test architecture aligns with product quality and customer specifications
- Own endtoend product engineering from first silicon through highvolume production
- Lead product characterization, corner analysis, and silicon debug
- Define and execute reliability qualification plans (JEDEC, customerspecific, automotive/industrial where applicable)
- Ensure robust RA processes for longterm product quality and customer confidence
- Lead all engineering activities for NPI, including pilot builds, risk production, and volume ramps
- Ensure ontime qualification, yield ramp, and manufacturing readiness
- Manage schedules, risks, and crossfunctional dependencies during product launches
- Serve as executive escalation point for NPI issues affecting delivery or quality
- Act as primary engineering interface with OSAT partners, foundries, and key suppliers
- Support strategic and highvisibility customer engagements, particularly for custom or ASIC programs
- Lead technical reviews, audits, and executivelevel customer escalations
- Ensure engineering alignment with contractual manufacturing and quality commitments
Qualifications
- Bachelor's degree in Electrical Engineering, Materials Science, Physics, or related field
- 15+ years of experience in semiconductor engineering and manufacturing environments
- Minimum 57 years in senior engineering leadership roles (Director / VP level)
- Strong handson background in:
- Packaging and backend processes
- Test engineering and yield optimization
- Product engineering and failure analysis
- NPI and highvolume manufacturing ramps
Preferred Skills
- Experience in fabless semiconductor companies or ASIC design service firms
- Proven experience working with OSATs and global manufacturing partners
- Background supporting advanced technology nodes and complex SoC products
- Exposure to automotive, industrial, AI, or highreliability market requirements
- Experience leading global teams across Asia and other regions
