TSMC R&D Process Engineer / FLM (Forward Looking Module)

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world's largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

In R&D, module is responsible for technology research, development, and implementation on the production line, with a focus on TSMC's mainstream technologies such as advanced process equipment for lithography, etching, diffusion, and thin film, required for N2, A14, and A10 nodes. Job responsibilities include the research and application of new materials, joint development of new process equipment with suppliers, development of process module technology and measurement technology for new components, addressing failures during the new process development, improving yield and transistor performance, stability assessment and cost reduction in the early stage of mass production, establishment of standard operating procedures, and transfer of technology to mass production plants.

Job Responsibilities:

1. Advanced PLASMA ETCH module process development for Advanced Technology node.

2. Evaluate new tool or hardware, new chemistry or gas, new material, or new process approach to enable transistor scaling.

3. Plasma Simulation, Monte Carlo, DTS, COMSOL, big data background is plus.

4. Work closely with integration, defect, device and other modules for yield improvement and device performance enhancement.

Job Qualifications:

1. Experienced professional

(1) Over 7 years of hands-on experience in plasma, chemical, and gas-phase etching within the semiconductor industry, including roles in both manufacturing and tool supplier.

(2) Plasma Etcher, ion beam, thin film Hardware development experience is plus. Ex: Power generator circuit, Plasma source, Chamber design.

2.Fresh student

(1) Ph.D. in Chemical Engineering, Material Science, Chemistry, Physics, Electrical Engineering ,Mechanical Engineering, or related engineering discipline (fresh Ph.D. graduates are welcome).

(2) Strong technical problem-solving and analytical skills with innovation and out of box thinking.

3.Basic requirement

(1) Fluent English.

(2) Relocation to Hsinchu (Taiwan) is required.

Fostering a global inclusive workplace reflects TSMC's core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.