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Technical Business Development Specialist (m/f/d)

  • Posted 15 days ago
  • Be among the first 10 applicants

Job Description

Do you think strategically, are you interested in the dynamic market of the Semiconductor Industry and promote the success of innovative technologies Take responsibility for the success of our products and solutions, develop sustainable strategies and promote innovative technologies in a promising market.

We are looking for the next possible date

  • Technology Scouting & Market Intelligence
  • Monitor industry trends and emerging technologies in semiconductor manufacturing and advanced packaging.
  • Identify future equipment opportunities related to:
    • Hybrid Bonding
    • Wafer-to-Wafer Bonding
    • Die-to-Wafer Bonding
    • Temporary Bonding & Debonding
    • Advanced Packaging Lithography
    • RDL Processing
    • Heterogeneous Integration
    • Chiplet Integration
    • Silicon Photonics
    • Co-Packaged Optics (CPO)
    • Glass Core Packaging
    • HBM Packaging Technologies
  • Analyze competitive technology developments and provide strategic recommendations.
  • Strategic Customer Engagement
  • Establish and maintain technical relationships with key customer engineering and technology organizations.
  • Support technical discussions with process integration, module engineering, R&D and advanced packaging teams.
  • Participate in customer technology reviews, workshops and roadmap discussions.
  • Serve as a trusted technical advisor to strategic customers.
  • Product & Technology Strategy
  • Translate customer technology requirements into actionable product development recommendations.
  • Support long-term product roadmap planning for:
    • Wafer Bonding Systems
    • Temporary Bonding & Debonding Platforms
    • Hybrid Bonding Solutions
    • Advanced Packaging Lithography Systems
    • Large Field Exposure Technologies
  • Identify technology gaps and future investment opportunities.
  • Competitive Intelligence
  • Monitor competitive activities, product launches and technology roadmaps.
  • Benchmark competitor solutions and identify differentiation opportunities.
  • Deliver regular market and technology assessment reports.
  • Business Development Support
  • Support strategic account planning and opportunity development.
  • Prepare technical presentations, technology assessments and business case evaluations.
  • Support major customer pursuits and technology evaluations.
  • Industry Engagement
  • Represent the company at major industry conferences and technical forums.
  • Build relationships with semiconductor research institutes, industry organizations and ecosystem partners.
  • Maintain awareness of emerging technology developments across the semiconductor industry.
Education

  • Master's degree or Ph.D. in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, Semiconductor Engineering or related disciplines.

Experience

Required:

  • Minimum 15 years of semiconductor industry experience.
  • Minimum 10 years of experience in one or more of the following areas:
    • Advanced Packaging
    • Wafer Bonding
    • Hybrid Bonding
    • Lithography
    • Process Integration
    • Semiconductor Equipment Development
Preferred

  • Experience with leading semiconductor manufacturers, OSATs or semiconductor equipment suppliers.
  • Experience interacting with senior technical leadership and executive management.

Personal Attributes

  • Strong technical leadership and influence skills.
  • Excellent communication and presentation capabilities.
  • Ability to engage with both technical and executive audiences.
  • Self-driven and comfortable operating in a highly dynamic environment.
  • Willingness to travel internationally.

We enrich your life with attractive rewardsWorking hours that accommodate your individual needsWorking together and celebrating togetherYour health is important to us

NT$8,000 annual travel subsidy, NT$5,000 club activity subsidy, Birthday voucher & Mid-Autumn gift box, Quarterly team gatherings & Family Day events

10 days of annual leave from day one, 14 days of paid sick leave per year, leave above Labor Standards Act requirements

Regular team-building events , family-friendly activities , supportive, people-first work culture

NT$8,000 health check subsidy (every two years), NT$1,000 vaccination subsidy (age 40+), Pre-employment health check covered

More Info

About Company

Job ID: 151938661

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Hsinchu, Taiwan

Skills:

silicon photonics technology scouting Advanced Packaging LithographySemiconductor Equipment DevelopmentHeterogeneous IntegrationCo-Packaged Optics CPOMarket IntelligenceWafer-to-Wafer BondingGlass Core PackagingHBM Packaging TechnologiesDie-to-Wafer BondingHybrid BondingChiplet IntegrationTemporary Bonding Debondingprocess integrationRDL Processing

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