Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > ASICS Engineering
General Summary:
As a system architecture technologist on STCO, this role focuses on system level architecture definition and technology pathfinding for advanced SoCs and chiplet based platforms. The position drives early architecture, packaging, and technology trade off decisions for next generation products, with emphasis on AI driven workloads, system efficiency, and scalability. The role works closely with system architecture, packaging, and technology teams to translate requirements into quantitative system KPIs and figures of merit, enabling consistent system level evaluation across product generations.
Minimum Qualifications:
- Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.
This role focuses on systemlevel STCO architecture definition and pathfinding for advanced SoCs leveraging 2.5D/3D and chipletbased architectures. The engineer defines system KPIs beyond PPAC, evaluates architecturetechnologypackaging tradeoffs, and supports early, highimpact design decisions for future platforms.
A key responsibility is to translate system and workload requirements into quantitative figures of merit (FOMs), including performance, power, thermal, yield, and AI efficiency and cost metrics, to support structured systemlevel KPI evaluation and STCO decision platforms.
Minimum Qualifications
- Experience with 2.5D and 3D STCO architecture and pathfinding, including chipletbased SoC systems.
- Strong understanding of systemlevel KPIs, including bandwidth, latency, performanceperwatt, thermal behavior, power integrity, yield, and cost, and how these depend on architecture, process technology, and packaging.
- Solid knowledge of heterogeneous SoC and chiplet architectures, including partitioning across compute, accelerators, memory, and I/O, with understanding of tradeoffs impacting interdie communication, memory hierarchy, power delivery, thermal coupling, manufacturability, and system cost.
- Experience with workloaddriven system design, particularly for AI inference, AI acceleration, HPC, or highperformance compute use cases.
- Understanding of AI system efficiency metrics, including tokens per second, tokens per watt, and cost per token, and how these metrics are influenced by architecture, memory bandwidth, interconnect, power, and thermal constraints.
- Ability to evaluate how system architecture and packaging decisions impact AI inference cost per token and overall system efficiency.
- Solid understanding of 2.5D/3D integration schemes, such as interposerbased designs and stacked die concepts, and their implications on system planning.
- Awareness of advanced packaging constraints, including thermal management, power delivery, and mechanical considerations in multidie systems.
- Basic programming proficiency (e.g., Python or equivalent) to support system modeling or architectural tradeoff analysis.
Additional Qualifications
- Demonstrated ability to work effectively across engineering and technology teams
- Ability to operate independently in earlystage and ambiguous problem spaces
- Strong analytical skills for datadriven architecture evaluation and interpretation
Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [Confidential Information] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
If you would like more information about this role, please contact Qualcomm Careers.
