Staff Electrical Design Engineer, AI Compute Motherboard

About The Role
Tesla's AI Compute electrical design team builds the system boards that power autonomous driving, humanoid robotics, and the data centers that train and serve our models. You will own complex high-speed motherboards built around Tesla's custom neural-engine silicon and leading x86/Arm processors, balancing inferencing performance, efficiency, cost, and reliability — from a single vehicle ECU up to scale-up and scale-out clusters in the AI inference data center.

Responsibilities:

Own hardware end-to-end: system architecture, electrical specification, SPICE simulation, schematics, prototype build, bring-up, and validation

Translate open-ended electrical discussions into concrete circuit schematics

Collaborate cross-functionally with silicon design, post-silicon, PCB layout, firmware, mechanical, signal and power integrity, thermal, reliability, EMC, and program management

Author bring-up and validation plans, then verify every feature and interface across PVT corners

Document electrical design requirements, calculations, and power budgets to a level that supports audit and reuse

Design for manufacturability, testability, and EMC compliance

Required Qualifications

Degree in Electrical / Computer Engineering, or equivalent industry experience

Demonstrated end-to-end PCB assembly design ownership, including hands-on bring-up, electrical validation, failure analysis, and system test

Strong high-speed board design (>10 Gbps) with PCIe, MIPI, Ethernet, DisplayPort, USB, or HDMI

Complex motherboard experience with high-performance x86/Arm processors and/or custom silicon

Working knowledge of AI SoC specifications — compute, memory bandwidth, network ingress/egress, peak power, storage — and benchtop bring-up

Hardware and software co-design experience optimizing inference for large language models

High-power, high-efficiency voltage regulator design

Solid analog and power fundamentals (MOSFETs, op-amps, switching regulators, gate drivers)

Experience shipping high-volume products from concept to mass production

Comfortable iterating with mechanical, thermal, and EMC partners under tight, evolving constraints

Track record of driving suppliers to meet reliability, performance, and scalability targets across the design-to-production lifecycle

Proficient with bench tools — oscilloscopes, BERT, network analyzers, signal generators

Preferred

Board layout experience in Cadence Allegro or Altium tools

AI training and inference processor internals (CPU / NPU / memory controller)

Inter-chip communication for scale-up AI clusters: 112G / 224G SerDes, UALink, scale-up Ethernet

Cutting-edge memory: GDDR6/7, HBM, DDR5, LPDDR4/5/6