Job Description:
Title: Staff Assembly Engineer
In Office ☒/Remote: ☐/Hybrid☐
Exempt ☒/ Non-exempt☐
Based: Hsinchu, Taiwan
Job Purpose:
Navitas Semiconductor (Nasdaq: NVTS) is a next-generation power semiconductor leader driving innovation in gallium nitride (GaN) and high-voltage silicon carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI data centers, high-performance computing, energy and grid infrastructure, and industrial electrification.
With more than 30 years of combined expertise in wide bandgap technologies, GaNFast™ power ICs integrate GaN power, drive, control, sensing, and protection, delivering faster power delivery, higher system density, and greater efficiency. GeneSiC™ high-voltage SiC devices leverage patented trench-assisted planar technology to provide industry-leading voltage capability, efficiency, and reliability for medium-voltage grid and infrastructure applications.
We are seeking a Staff Assembly Engineer to join our fast-growing, collaborative team. The ideal candidate is self-motivated, energetic, and able to thrive in a high-growth, innovative environment, contributing directly to technologies that are shaping the future of power electronics.
Key Responsibilities and Duties:
- Work with subcontractors on Assembly Processes Characterization. Risk base review on New Product/Package Introduced and create evaluation based on the risk identified. Will follow thru execution and closure.
- Review or generate Process specs and other documents, follow up review and approval by different teams within the organization.
- Work with Subcontractors in designing and improving leadframe, BOM.
- Work with Subcontractors on NRE tooling quote, PO release and delivery.
- Manage and prevent risks in running NPI products in assembly, closely monitor and on-site follow up on critical NPI builds.
- Support investigation and resolution of quality, yield and customer return issue. Daily sustaining to smooth the normal production.
- Regular online meeting with cross functional team (NPI, Delivery, Quality and Customer related).
- Lead overall execution locally at Subcon side together with global team.
- Use Project management tool is an advantage to manage NPI activities in subcon from process characterization to assembling Qualification lots to Mass Production Release.
Required Qualifications
Basic
- Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering, or related majors.
- Must be fluent in English in writing and speaking. Preferably can communicate also in Mandarin.
- Must have at least 5 years process engineering experience in a Semiconductor backend facility.
- Experienced with Wafer Saw, Laser Groove or DB or WB or EOL Assy. Advantage to have average understanding in the whole Assembly Process.
- Experienced with Engineering Problem Solving Tool like FMEA, SPC, Control plan, OCAP, 8D, MSA. Advantage on expert user on DOE.
Preferred
- Experienced in the whole Assembly Process (from Dicing to Singulation & Tape and Reel)
What We Offer
- A front-row seat to the future of power electronics. Work on cutting-edge GaN and SiC technologies that are transforming AI data centers, electrification, and global energy infrastructure.
- A fast-paced, high-energy environment. We move quickly, make decisions with purpose, and empower employees to take ownership and drive real impact from day one.
- A team that shows up and delivers. We care deeply about our mission, our customers, and each other. We collaborate, support one another, and bring intensity and accountability to everything we do.
- Full support to succeed. You'll have access to leadership, cross-functional collaboration, and the resources needed to innovate and execute at a high level.
- Competitive total rewards. Comprehensive health, dental, and vision coverage, unlimited PTO, and a competitive compensation package including base salary, performance bonus, and equity awards.
