Overall purpose of role:
To work with PLs (both Discrete and PIC and IPM) on the package developments including thermal and stress simulation for internal and external requests.
Job Duties
- :Interact with PLs, product engineers and silicon designers in US and overseas on package design
- .Interact with internal assembly site and external OSAT (Out Sourcing Assembly and Testing) partners on the package designs and carry out from concepts to M
- PInteract with material suppliers, such as LF, clip, solder, mold compound and assembly tools for assembly process enhancements.
Desired Skills/Qualification
- s:5 to 10+ years of experiences in Power Electronics package design (Si, GaN, SiC; LF based, substrate base
- d)MS degree and abo
- veExperience in AutoCAD and SoldWorks for package desig
- nsExperiences Ansys for thermal and stress simulati
- onLead Frame (LF), design, clip design, wire bon
- d Experiences in RD concept development and novel power electronics packaging technologi
- esExperience with assembly manufacturing processes and environment (soldering, die attach, wire bonding and moldi
- ngExperiences in MIS substrate design and IPM design is a pl
- usProfessional communication in technical subjects with internal and external group
s.
