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Join Trend Join New Generation
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Trend Micro Vision One is a purpose-built threat defense platform that provides added value and new benefits beyond XDR (Extended Detection and Response) solutions, allowing customer to see more and respond faster. Vision One providing deep and broad extended detection and response capabilities that collect and automatically correlate data across multiple security layers-email, endpoints, servers, cloud workloads, and networks-Trend Micro Vision One prevents the majority of attacks with automated protection.
The objective of TW Engineering Group 1 is to provide the best endpoint security solution to help customers, from small & medium businesses to vary large enterprises, conquer cybersecurity challenges effectively and efficiently. Every partner within Group 1 will have opportunity to join diverse squad team and demonstrate his/her expertise and enthusiasm to make customer success in their business without cyber threat. Along this journey, we are looking for partners with not only exceptional engineering expertise, but also great curiosity and customer empathy, so we can learn from customer behavior and create business impact together.
Job description
Required skills
Nice to have skills
Personality
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Job ID: 101814915
Skills:
snowflake , BigQuery, Apis, Sql, Sql Scripts, Gcp, UI, Data Warehousing, Azure, Python, AWS, Validation, DevOps practices, ETL ELT processing, CI CD pipelines, Data Analysis, Data Engineering and Processing, data models
Skills:
silicon photonics , vision systems, fiber attach, 6-axis alignment systems, optical adhesives, optical assembly tools, process monitoring, semiconductor laser packaging, fiducial recognition, yield improvement methods, optical assembly process development, automated optical alignment, opto-mechanical design, precision fiber alignment
Skills:
Drm, Software Testing, Test Case Creation, JIRA, Istqb Certification, Jenkins, Defect Tracking, Confluence, Automation Tools, Selenium, Python, Broadcast technologies, Streaming technologies, DASH, English, UNIX based systems, HLS, Embedded Systems, Qa Processes, Xray, Chinese, Digital TV standards
Skills:
electromagnetic theory, Chip Package and PCB co-design methodology, PCB stack-up and breakout strategy, IO placement, Pcb Design, assembly and substrate manufacturing process, electrical modeling, high speed interface SI constraints, system co-design, die floor planning, power distribution network PDN constraints, transmission line theory, bump placement
Skills:
MATLAB, Python, Ads, ALLEGRO, Signal Integrity, TDR, VNA, hfss