Senior Staff Engineer Subcon Package Development

Based in Taiwan, this Senior Staff role will act as a technical expert to drive advanced packaging process development and supplier collaboration for photonic enginearchitectures and next-gen light sensor projects. The individual will bridge internal project teams and global OSATs to deliver robust manufacturing solutions from concept to mass production.

Key Responsibilities:

Process Development & Execution: Lead packaging process development procedures in OSATs, ensuring absolute alignment with product requirements, engineering specifications, and project milestones.

Risk Management & Problem Solving: Systematically assess process risks for new product introductions; drive technical benchmarking, failure analysis, and structural root-cause analysis in problem solving process.

OSAT Governance & Collaboration: Optimize suppliers technical fit and drive higher execution standards for fulfilling engineering requirements and package development roadmap; build long-term frameworks and improvement plans with key partners and explore alternative technology options.

Innovation & Cross-Functional Bridge: Contribute breakthrough ideas to the technology roadmap; serve as the primary packaging process technical expert among cross-functional team.

Design Rule & Specification Ownership:Manage and strengthen the OSATs technical capability database and package design rules for DFM. Oversee engineering design drawings reviews to ensure precise dimensions & tolerances matching with product requirements and process capability.

Job Requirements:

Experience:

Minimum of 7+ years of solid experience in semiconductor packaging development, with a proven track record of leading complex technical projects.

Direct experience in Optical Packaging, Optoelectronics, or Silicon Photonics / Datacom packaging (e.g., high-speed substrates, optical alignment, 2.5D packaging technology) is highly preferred.

Technical Skills:

Subject-matter expertise in backend processes (advanced die attach, precision molding, substrate design, wafer-level packaging).

Exceptional skills in advanced failure analysis, statistical tools, and DFM.

Leadership & Communication:

Strong leadership capability to influence internal stakeholders and externally drive OSAT execution without direct authority.

Fluent in English and Mandarin with excellent communication and strategic negotiation skills.