Senior Process Integration Engineer (Technology/Development/Manufacturing)

Key Responsibilities

• Development and optimization of RFSOI process technologies for 2DIC and 3DIC.

• Collaborate with device teams to co-optimize RF device performance and layout for high-volume manufacturing.

• Drive yield improvement, reliability testing, and failure analysis for RFSOI products.

• Interface with fab teams to scale new technologies from R&D to production.

• Evaluate emerging materials, process modules, and device structures to enhance RF performance.

Qualifications

• Masters or Ph.D. in Electrical Engineering, Materials Science, Semiconductor Physics, or related field.

• 3+ years of experience in RF semiconductor technology development, with a strong focus on SOI platforms preferred.

• Proven track record in developing and transferring RF technologies to high-volume manufacturing preferred.

• Strong project management and communication skills.

Interested applicants, please click Apply Now or email your detailed resume (MS Word or PDF) to: [Confidential Information]

Tempserv Pte Ltd

EA License No: 06C3745

Consultant: Chuah Siew Ping/EA Personnel No: R24123260