Position Overview We are seeking a highly versatile and cross-disciplinary engineer to lead the chip level integration of complex photonic-electronic systems. This role spans front-end, back-end implementation, and advanced packaging of EIC and PIC. The ideal candidate will architect robust and scalable multi-chip systems while collaborating closely with optics and electrical teams on system-level integration. Key Responsibilities 1. Multi-Domain Co-Design & Architecture: . Lead chip-to-chip packaging architecture for high-I/O systems (500-10,000+ channels), integrating photonic and electronic dies. . Work with design team to define and optimize layout strategies and high-speed electrical interconnects. . Develop co-design methodologies to balance optical performance, signal/power integrity, thermal management, and mechanical reliability. 2. Advanced Packaging Development: . Design and implement high-density interconnect solutions using TSV, TMV, hybrid bonding, and silicon/glass interposers . Drive material selection and process development for low-loss, high-thermal-stability packaging . Characterize and model multi-physics behaviour (optical, electrical, thermal, mechanical) in packaged systems 3. Cross-Functional Integration: . Collaborate with photonics teams on waveguide layout and optical I/O placement . Work with mechanical and thermal engineers on package structural design, cooling solutions, and thermo-mechanical reliability . Interface with scanner optics and electronics teams (e.g., Vincent) on system-level integration and interface specification 4. Technology & Supplier Engagement: . Qualify and manage OSAT and foundry partners for substrate fabrication, assembly, and testing . Lead design-for-manufacturability (DFM) and design-for-test (DFT) initiatives with supply chain teams Qualifications 1. PhD/MSc in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, or a related field 2. 3+ years of experience in multi-chip packaging, photonic-electronic integration, or complex system co-design 3. Proven background in two or more of the following: . High-density interconnect design (500 I/O, 2.5D/3D integration) . Photonic layout and waveguide-based device integration . Electro-optical/thermo-optical phase shifter design or packaging . Mechanical and thermal modelling of packaged systems . Material selection for optical/electronic packaging
