Senior Co-Packaged Optics Process Engineer
Job Description
The NVIDIA Networking IC Co-Packaged Optics Engineering team is seeking an experienced Senior Optical Process Engineer for co-packaged optics products. This role involves close collaboration with various IC Product Engineering teams, including hardware, test engineering, and product engineering, as well as the Operations team and leading semiconductor vendors and assembly/test providers worldwide. The position requires a strong understanding of optical assembly process, active optical alignment equipment and processes to ensure stable, efficient, and smoothly running production line. This enables high availability while maintaining the quality of products shipped to customers.
What You'll Be Doing
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What You'll Be Doing
- Ensure end-to-end assembly process readiness for CPO products at NV manufacturing partners.
- Collaborate closely with RnD, PE and Operations to ensure robust manufacturing capabilities and reliability of CPO products and assure mass production is running smoothly.
- Yield analysis monitoring and drive continues improvement initiatives for NPI production lines, ensure optimal yield and efficiency to achieve NVIDIA capacity and cost target.
- Maintain products quality by improving design and manufacturing process as well as equipment stability.
- Provide onsite engineering support: technical ownership and support for process or equipment issues.
- BS/MS degree in Mechanical Engineering, Optical Engineering, Material Science and/or related field.
- 5+ years experience in relevant fields – mass production, optical alignment process development, and data processing & analysis.
- Participate in the process of bringing up a new technology from the R&D stage to high volume manufacturing.
- Hands-on debug experience with strong problem-solving ability.
- Proficient in SPC, 6 sigma, quality control process; good understanding of machine and process interactions.
- Excellent communication/presentation skills in English.
- We are seeking applicants who demonstrate the ability to work independently, deliver results promptly, communicate effectively, operate with a sense of urgency, and thrive in a fast-paced development and production environment.
- Knowledge in Flip Chip Packaging / multi-chip module/ hybrid bonding / Optical Connector Assembly/ Optical Connector to chip attach.
- Hands-on experience working with machines and optimize process recipes.
- Knowledgeable in DFx, FMEA process, and failure analysis methodologies.
- Know-how of yield analysis and process cycle time reduction methodology.
- Experience working with OSAT in volume manufacturing environment as well as a background with the semiconductor or optical communication industry.
, , JR2013095
More Info
Key Skills
process cycle time reduction methodology
yield analysis
6 sigma quality control process
active optical alignment equipment
Flip Chip Packaging
FMEA process
mass production optical alignment process development
data processing analysis
failure analysis methodologies
Optical Connector to chip attach
multi-chip module hybrid bonding
Optical Connector Assembly
machine and process interactions
DFx
optical assembly process
