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Winbond

(??/??) SAP ?????_??????

Winbond
Hong Kong
3-5 Years
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  • Posted 2 months ago
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Job Description

(/) SAP _


1. SAP FI
2.
3. SAP ABAP
4. COMMSD
5.
6.

(.539)






3

No
No

No

1. 3 SAP FI
2. SAP ABAP ReportALVEnhancementInterface
3.
4. API / Web Services
5.

#LI-LL1

More Info

Job Type:
Permanent Job
Industry:
Electronic Components/Semiconductors
Function:
Sap Development
Employment Type:
Full time

About Company

Winbond

Job ID: 140017763

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Last Updated: 14-03-2026 08:56:07 PM
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