R&D Packaging Simulation Engineer

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world's largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Join our R&D Advanced Packaging team and become the critical compass, expertly guiding seamless integration and module optimization. You will be instrumental in pioneering cutting-edge advanced packaging solutions - the very foundation that powers the world's most advanced electronics and enables world-class AI platform foundries. Your predictive insights will be the definitive key to achieving unparalleled success, fundamentally reshaping the entire industry ecosystem.

Job Responsibilities:

1. Develop and apply advanced simulation models for complex advanced packaging structures.

2. Perform comprehensive analyses to predict and optimize packaging performance, reliability, and manufacturability.

3. Collaborate closely with design, integration, and process teams to translate simulation insights into tangible design and process improvements.

4. Validate simulation models against experimental data, driving continuous improvement in model accuracy and predictive capability.

5. Contribute to the strategic roadmap for advanced packaging simulation, exploring new methodologies, tools, and intellectual property.

Job Qualifications:

1. MS or Ph.D. in Electrical, Mechanical, Chemical, Materials Science, Physics, or a related engineering/science discipline.

2. Possesses strong technical problem-solving and analytical skills, grounded in fundamental principles, with a proactive, hands-on approach and a strong sense of ownership; consistently demonstrates a growth mindset for continuous learning and development.

3. Exceptional team player who fosters trust, drives innovation with disciplined execution, and is fluent in both Mandarin and English with excellent cross-functional communication skills.

Fostering a global inclusive workplace reflects TSMC's core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.