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Process Engineer Intern (Wire Bonding)

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  • Posted 10 hours ago
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Job Description

  • To work with operation/maintenance to ensure production smoothly.
  • To assist action confirmations with system monitors.
  • To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator.

Job Qualification

  • Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures
  • Bachelor's or Master's student in Material/Science/Electronic Engineering or related
  • Available to work at least 3 days/week.
  • Good verbal and written English communication skills
  • MS Office or Programming skill
  • Self-motivated, results oriented, willing and eager to learn, proactive attitude

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Job ID: 148955779