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Job Summary: Introduction

As a Package Materials Engineer in Micron's Advanced Packaging Technology Development (APTD) organization, you will be expected to develop or select materials, integrate them into packaging solutions, characterize wafer and die level packages. As a Materials Engineer in APTD, your primary responsibility will be materials and process development to meet the packaging requirements of next generation semiconductor products. You will be expected to work with cross-functional teams to define and develop new 3D Integrated (3DI) packaging solutions including integrated Through Silicon Vias that enable next generation 3DI packaging technology to be transferred to high volume manufacturing. You will also be responsible for sustaining and making the improvement efforts to yield and equipment performance to achieve high device yield, reliability, and cost efficiency. Exert significant latitude in defining objectives of assignment and take accountability for delivering solutions that meet program objectives. You will be expected to work independently without considerable direction and yet demonstrate ability to guide individuals towards project objectives. You will be recognized as a material expert in broader areas by peers in the Manufacturing and Technology Development organizations. Project scope not limited to specific process but a number of integrated processes or materials.

Responsibilities and Duties include, but not limited to:

• Ownership of a technical area for materials characterization
  • Provide knowledge of leading edge materials characterization techniques and of new applications and data analysis methodologies.
  • Drive improvement and technical innovation in materials, methods and processes.
  • Have a good theoretical and operating knowledge of all the techniques in your area.
  • Serve as a technical expert within your discipline to team members and managers at site level.
  • Attend external workshops and conferences, give lectures and generate publications.
  • Management of the equipment maintenance by performing diagnostics and interacting with the supplier and the maintenance team. Provide first-line defense for the equipment.
• Contribution to Technology Development Objectives
  • Have a thorough knowledge of department and organizational goals and objectives to ensure daily tasks incorporate these goals and objectives to meet Technology Development needs.
  • Engage in process development projects with cross team interaction, providing expert contribution in the field of materials characterization.
  • Global coordination of mechanical characterization and testing for advanced packaging development efforts.
  • Provide recommendations for test structure and test vehicle design for material property evaluation
  • Review and summarize and present data with recommendations of materials and lead the discussion with packaging material suppliers in meeting material technical specification and roadmaps
  • Be proactive and take initiative in new packaging material pathfinding work and exploration
  • Lead in driving resolution of issues encountered during package characterization and in resolving packaging material related qualification and production issues
• Mentoring
  • Provide advice and guidance to less experienced team members. Mentor materials characterization engineers and technicians.
  • Transfer his/her expertise to younger engineers, on the job or teaching at internal courses.
• Analytical Service
  • Management of the service for the techniques in his/her responsibility.
  • Regularly review service results and direction with supervisors.
• Safety and Housekeeping
  • Apply all the procedures and practices concerning safety and housekeeping.

Qualifications and Skills include, but not limited to:

• At least 5 years experience in semiconductor material related industry
• Degree/Major: Ph.D in Chemistry, Physic, Material or related field
• Familiar and well-versed in package and/or materials characterization techniques such as FT-IR/XPS/ToF-SIMS/TMA/ DSC/ TGA/ warpage analysis tool/ CSAM/ ball bond shear and/or pull testing
• Knowledge of material related failure mechanisms, chip-package interactions, reliability testing, and reliability modeling is preferred
• Possess hybrid bonding (chip to wafer or wafer to wafer) related material characterization skills and fundamental knowledge.
• Deep knowledge Advanced Packaging and Memory Integration DRAM, SRAM, NAND (3DIC, FO, Hybrid bond...etc)
• Excellent data extraction, analysis and reporting and decision skills. (data mining, JMPetc)
• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
• Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
• Good communication skill to align the perspective through cross functional teams
• Demonstrated tenacity and ability to work with stringent timelines and manage resources effectively.
• Ability to work effectively with minimal supervision, and drive recommendations and decisions.
• Highly motivated and seeking to continue to learn, apply and lead with a growth mindset

Fluent communication in English

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

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