Work items:
1. Use simulation software to package power supply and Signal Integrity Simulation
2. Familiar with FCCSP/FCBGA/wBGA/QFN/QFP package substrate design and process and extract model
3. Pre-assess package type simulation with packaging engineers
4. Establish layout guide
5. Judge IO/PKG/PCB simulation results, coordinate the front-end IC terminal PAD row, coordinate the back-end PCB row Pin
6. Do telecom layout review with packaging factory, design in the shortest time Produce the optimized PKG and import PKG into mass production Graduated from majors in power machinery, automatic control, and communication engineering.
2. Familiar with FCCSP/FCBGA/wBGA/QFN/QFP packaging substrate design and process related experience is preferred
(MD1880035 )
