Packaging Development Engineer

We are seeking a motivated and technically skilled Packaging Development Engineer to support the development of innovative MEMS sensor products.

Key Responsibilities

- Packaging Development Engineer for MEMS products

- Package design and process development in co-operation with supplier and product engineering team for electronic sensors.

- Develop and optimize assembly processes for MEMS in automotive and consumer-electronics acoustic applications.

- Oversee sample manufacturing and process qualification at assembly partners.

- Team work in English language with a multitude of international interfaces is mandatory.

Requirements

- 3-8 Years experience in packaging/assembly of semiconductors components, especially familiar with LGA, BGA, DFN, WLCSP, SiP, micro-phone

- Preferred solid technical background in assembly technology. Experience with acoustic device development is a plus.

- Passion for developing technical solutions in multidisciplinary international projects

- Experience in international corporation

- Excellent English skills (verbal and written); willingness to travel as required.

- Good teamwork with multitude of international interfaces

Please apply via below link

• SmartRecruiter: https://smrtr.io/wP3yD
• 104 website: https://www.104.com.tw/job/8vzjqjobsource=vipshare&utm_source=vip&utm_medium=share_copy