We Are:
At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.
You Are:
You are an experienced and highly skilled Principal Package Design Engineer with a passion for innovation and a drive to excel in the field of electronic design. With over 20 years of relevant experience, you bring an extensive understanding of advanced circuit and transmission line theory. Your proficiency in 3D Electromagnetic modeling tools, such as HFSS, along with your familiarity with both Windows and Linux operating systems, positions you as an expert in your field. You possess strong verbal and written communication skills in English, allowing you to effectively collaborate with team members and clients globally. Your can-do attitude, quick learning ability, and solid electronic skills are assets that make you a valuable addition to any team. You thrive in a dynamic, supportive environment and are eager to contribute to the success of Synopsys by ensuring our IP test chip packages meet performance requirements and by helping customers explore their package solution space options with Synopsys IPs.
What Youll Be Doing:
- Collaborating in the early design stages to optimize and define requirements for SIPI performance, such as bump maps.
- Supporting 25-30 PHY Test Chip Package designs per year.
- Assisting customers in exploring their package solution space options with Synopsys IPs.
- Modeling and analyzing package substrate and PCB designs.
- Coordinating package design phases and flow.
- Resolving a wide range of issues in creative ways regularly.
- Providing regular updates to the manager on project status.
- Representing the organization on business unit projects.
The Impact You Will Have:
- Ensuring Synopsys IP test chip packages meet and exceed performance requirements.
- Enhancing customer satisfaction by providing expert guidance on package solution space options.
- Contributing to the successful design and implementation of 25-30 PHY Test Chip Package designs annually.
- Improving the efficiency and effectiveness of package substrate and PCB design processes.
- Driving innovation through the resolution of complex design issues in creative ways.
- Maintaining project momentum and delivering timely updates to stakeholders.
- Strengthening Synopsys&apos reputation by representing the organization in business unit projects.
What Youll Need:
- Minimum of 20+ years of relevant experience.
- Advanced knowledge of circuit and transmission line theory.
- Experience with 3D Electromagnetic modeling tools (e.g., HFSS or similar).
- Proficiency in both Windows and Linux operating systems.
- Bachelors degree in Electrical, Electronic Engineering, or equivalent.
Who You Are:
- An innovative problem solver with a can-do attitude.
- A quick learner with solid electronic skills.
- A strong communicator, both verbally and in writing.
- A collaborative team player who thrives in a global, high-skilled, and supportive team environment.
- A professional who can act independently on new or special assignments.
The Team Youll Be A Part Of:
You will be part of a dynamic and supportive team of highly skilled professionals dedicated to advancing the field of electronic design. Our team collaborates globally, bringing together diverse expertise to innovate and solve complex challenges. Together, we drive the success of Synopsys by ensuring our IP test chip packages meet the highest performance standards and by helping customers explore their package solution space options with our IPs.
