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MTB Defect Insight Engineer

MTB Defect Insight Engineer

Micron Technology
  • Posted 12 hours ago
  • Be among the first 10 applicants

Job Description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

MRDA Defect Insight Engineering Scope

Data Analytics

  • Yield correlation analysis
  • Spatial signature analysis
  • Defect density monitoring
  • Process-health dashboards
  • AI/ML model deployment with Agentic AI
  • Predictive excursion detection

Defect Management

  • Defect inspection strategy development
  • Inline defect monitoring
  • Defect pareto analysis
  • Defect source identification
  • Yield detractor elimination
  • Killer defect reduction

Job requirements

  • Bachelor's or Master's degree in Engineering or related discipline
  • 0–2 years of experience in semiconductor manufacturing or engineering
  • Basic knowledge of ASSY defect analysis for yield improvement
  • Basic knowledge of SPC,FDC or data analysis tools, ie JMP...etc
  • Utilizes baseline digital and AI capabilities appropriate to the role to responsibly leverage AI technologies for research, analytical insights, content generation, process improvement, problem resolution, and the achievement of business objectives.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at [Confidential Information].

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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Key Skills

Yield correlation analysis

AI ML model deployment with Agentic AI

Predictive excursion detection

Yield detractor elimination

Inline defect monitoring

Defect pareto analysis

Defect source identification

Process-health dashboards

Defect density monitoring

Killer defect reduction

Defect inspection strategy development

Basic knowledge of ASSY defect analysis for yield improvement

Spatial signature analysis

About Company

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Taiwan, Taichung
Skills:
Killer Defect Reduction, AI-enabled enhancements, AI-assisted tools, AL ML deployment, Yield detractor elimination, Inline defect monitoring, Defect pareto analysis, Process healthy dashboard, Defect source identification, Defect Inspection strategy development, Predictive Excursion Detection, AI literacy, Defect Density monitoring, Yield Correlation analysis, Spatial signature analysis