Module Product Engineer

Position Summary

We are seeking an experienced Module Product Engineer to own the technical readiness, manufacturability, reliability, and lifecycle performance of advanced power modules (Si, SiC, GaN) from New Product Introduction (NPI) through high-volume production and sustaining. This role is accountable for end-to-end product execution across design, test, qualification, reliability, quality, assembly, and manufacturing — delivering on performance, quality, cost, and schedule targets at scale.

The Module Product Engineer serves as the central technical owner who bridges R&D, reliability engineering, manufacturing, and customer-facing teams to ensure every power module shipped meets the highest standards of quality and long-term field reliability.

Key Responsibilities

Product Engineering & NPI Execution

• Own product engineering execution for advanced power modules from NPI through high-volume production and sustaining.
• Lead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams.
• Define and maintain product specifications, limits, and guard-bands based on silicon behavior and manufacturing capability.
• Drive corner lot planning including characterization and qualification testing.
• Drive wafer acceptance test (WAT) to final test specification alignment.
• Own manufacturing release, qualification execution, and product change management (PCNs).
• Drive design for test and manufacturability, and quality improvement through PPM reduction.

Manufacturing & Assembly Ownership

• Own the manufacturability of advanced power modules, driving robust assembly processes across OSAT and internal manufacturing sites.
• Establish and enforce assembly workmanship standards, ensuring compliance with IPC-A-610 (Acceptability of Electronic Assemblies).
• Drive cross-functional alignment across Design, Test, Quality, and Manufacturing to enable scalable, high-yield module production.
• Lead resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects.
• Proficient in both front-end and back-end manufacturing processes.

Qualification & Reliability Testing

• Collaborate with Reliability Engineering to define, execute, and analyze qualification and reliability testing for power modules (Si, SiC, GaN).
• Develop and implement comprehensive reliability test plans aligned with IPC-9592 / IPC-9592B — the industry standard for design, qualification, and manufacturing conformance of power conversion devices.
• Execute and oversee reliability tests including: High Temperature Reverse Bias (HTRB), High Temperature Gate Bias (HTGB), Highly Accelerated Stress Test (HAST), Temperature Cycling (TC), Power Cycling (PC), Thermal Shock, Vibration, Mechanical Shock, Storage tests (HTS, LTS), Life testing, and Burn-in.
• Apply Design for Reliability practices per IPC-9592 regarding MTBF, derating, FMEA, corrosion, and moisture sensitivity.
• Monitor new product design reliability testing and perform interval shift analysis.
• Ensure compliance with industry standards and validate that products meet customer, regulatory, and internal reliability requirements.
• Strong understanding of automotive standards and AEC-Q qualifications.

HALT / HASS Implementation

• Conduct HALT (Highly Accelerated Life Testing) and HASS (Highly Accelerated Stress Screening) following IPC-9592A / IPC-9592 guidelines for environmental stress testing, mechanical robustness, and early-life failure detection.
• HALT and HASS coverage includes environmental stress testing (temperature, humidity), HTOB, THB, power cycling, shock and vibration, drop, corrosion, and ESD immunity.
• Develop operational and destruct limits for power modules through HALT methodologies and establish production screens under HASS.

Yield, Data Analysis & Continuous Improvement

• Lead yield analysis, parametric trend monitoring, and root-cause investigations.
• Drive cost, yield, and cycle-time improvement through data-driven analysis.
• Hands-on experience with FA laboratories, Design of Experiments (DOE), and material/process characterization.

Customer & Stakeholder Engagement

• Actively collaborate with internal and external customers to address complex technical challenges through technical liaison, on-site consultations, and comprehensive presentations.
• Serve as the technical escalation owner for production issues, customer returns, and corrective actions.
• Support critical customer engagements on product, quality, and manufacturing topics as needed.
• Lead cross-functional projects and collaborate with global teams, customers, and suppliers.
• Travel: approximately 10%; some overseas travel may be required for training, product transfers, and release.

Required Qualifications

Education

• Bachelor's degree required in Electrical Engineering, Computer Engineering, Electronics Engineering, Materials Science, Microelectronics, or a related field.
• Master's degree preferred in a relevant engineering discipline. Mechanical Engineering background is a plus, particularly for roles involving module packaging, thermomechanical behavior, and assembly optimization.

Experience

• 8+ years of experience in semiconductor product engineering, manufacturing engineering, or test engineering, with demonstrated ownership from NPI through high-volume production.
• Strong technical depth in semiconductor power products (IGBT, MOSFET, SiC, GaN) and advanced power module manufacturing.
• Demonstrated expertise in product engineering, assembly and packaging development, and failure analysis.
• In-depth knowledge of power module design, assembly methods, and packaging processes.
• Extensive background in stress testing, reliability qualification, and root-cause investigation.
• Practical experience with environmental and electrical stress testing equipment.
• Familiarity with IPC-9592 / IPC-9592B qualification, reliability, and manufacturing conformance requirements.

Technical Skills

• Understanding of thermal, electro-thermal, and mechanical fatigue failure mechanisms in power modules.
• Working knowledge of new product development, qualification, and high-volume manufacturing transfer.
• Strong understanding of automotive standards and AEC-Q qualifications.
• Advanced proficiency in data analysis tools including JMP, Minitab, Python, and Excel.
• Proficiency in reliability statistical methods (Weibull analysis, DOE).
• Proficient in both front-end and back-end semiconductor manufacturing processes.

Soft Skills

• Proven leadership in overseeing cross-functional projects and collaborating across organizations.
• Exceptional project ownership, organizational abilities, and stakeholder management skills.
• Excellent communication and presentation capabilities — skilled at articulating complex technical concepts to internal and external stakeholders.
• Strong analytical and troubleshooting capability with confident, systematic decision-making.
• Ability to coordinate across multi-disciplinary teams in a global environment.
• Strong written and verbal communication skills with customers and cross-functional teams.