Mechanical Engineer
Location: Hsinchu
Job Type: 6-Month Contract
Team: Packaging Engineering – Ayar Labs
About Ayar Labs
Ayar Labs is pioneering the future of computing with industry-leading
optical I/O technology, enabling dramatically higher bandwidth, lower latency, and improved energy efficiency compared to traditional electrical interconnects. Our silicon photonics solutions integrate optics and electronics to transform AI, cloud, HPC, and defense systems.
We are seeking a
Mechanical Engineer (Contract) to support mechanical design and thermal-mechanical simulation efforts for silicon photonics and laser packaging programs. This role will collaborate closely with cross-functional engineering teams to support product development and prototype execution.
Responsibilities
- Execute mechanical design of silicon photonics packages, laser modules, and related system components.
- Design and optimize fiber array interfaces and fiber routing solutions for high-performance optical modules.
- Develop tooling fixtures to support optical and electrical assembly, alignment, and testing.
- Conduct tolerance stack-up analysis to ensure manufacturability and robust assembly.
- Create, release, and manage engineering change orders (ECOs), including parts, assemblies, and bill of materials (BOM).
- Coordinate with external vendors to support prototype fabrication and procurement.
- Perform thermal-mechanical simulations for silicon-photonics and laser packages to ensure performance and reliability.
- Work cross-functionally with optical, electrical, packaging, and manufacturing teams to drive design implementation and schedule execution.
Basic Qualifications
- Bachelor's degree in Mechanical Engineering (or equivalent).
- Minimum 3 years of industry experience in thermal-mechanical simulation and mechanical design.
- Proficient in SolidWorks (or equivalent CAD tools) for detailed mechanical design.
- Strong proficiency in ANSYS for thermal/mechanical analysis.
- Solid understanding of mechanical engineering principles including materials, thermal management, structural analysis, and tolerance analysis.
- Ability to work both independently and collaboratively in a fast-paced environment while managing multiple assignments and tight schedules.
Preferred Qualifications
- Experience with silicon photonics, laser packaging, or optoelectronic module assembly.
- Experience with flip-chip assembly and optical alignment processes.
- Knowledge of optical fiber routing and fiber array integration.
- Familiarity with rapid prototyping and design-for-manufacture (DFM) methodologies.
- Strong communication skills and ability to drive cross-functional technical decisions.
