Job Description
MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.
MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.
MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.
MACOM is an Equal Opportunity Employer.
We consider applicants for all positions without regard to race, color, religion, creed, gender, national origin, age, disability, marital status or veteran status or any other legally protected status.
Manufacturing Engineer – InP Photodiode WAT Assembly
Location: Hsinchu, Taiwan
Company: MACOM
Manufacturing Site: Subcontract / OSAT partner (frequent on‑site support required)
About The Role
MACOM is seeking a Manufacturing Engineer based in Hsinchu, Taiwan to support the wafer acceptance and WAT (Wafer Acceptance Test) assembly process for Indium Phosphide (InP) photodiode devices manufactured at a subcontract backend partner.
This role provides technical and manufacturing oversight of key assembly steps, including photodiode die attach to carrier (CoC), die shear testing, and CoC die attach into QFN packages. While production is executed at the subcontract site, the engineer will act as MACOM's primary technical interface, ensuring stable output, strong yield performance, and continuous improvement in a high‑volume manufacturing environment.
The position combines hands‑on process engineering with manufacturing execution and supplier engagement, and requires regular presence at the subcontract manufacturing site.
Key Responsibilities
Provide technical oversight of the InP photodiode wafer acceptance assembly process.
Support and troubleshoot CoC die attach, die shear testing, and QFN assembly processes.
Maintain process stability using SPC, control plans, and standard work.
Work closely with subcontractor operations to support capacity alignment, throughput improvement, and cycle time reduction.
Lead root cause analysis for yield, mechanical integrity, and assembly‑related issues.
Act as MACOM's technical interface with the subcontract partner, supporting issue resolution and execution discipline.
Support NPI, engineering builds, technology transfers, and continuous improvement initiatives.
Train subcontractor engineers and technicians on process best practices, handling, and yield optimisation.
Track manufacturing KPIs and drive yield, cost, and productivity improvements.
Work with internal cross functional teams to disposition and determine root cause of failing wafers.
Qualifications
Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or related field.
3–6 years of experience in semiconductor backend manufacturing or assembly engineering.
Experience with die attach processes, mechanical testing (die shear), and QFN or leadframe‑based packages.
Exposure to InP, III‑V materials, photodiode, laser, or optoelectronic devices is strongly preferred.
Familiarity with OSAT or supplier‑based manufacturing environments.
Strong analytical and structured problem‑solving skills.
Experience using JMP, Minitab, Power BI, or similar data analysis tools.
Strong English communication skills.
Willingness to travel regularly to subcontract manufacturing sites and work hands‑on in production environments.
