LPKF: Business Development Manager-Glass for Advanced Packaging

Location:

Taiwan (Hsinchu / Taipei / Taichung)

Territory:

Taiwan, Japan, Mainland China

Reports to:

Head of Business Development / VP Sales & Marketing

Travel:

Approx. 40–50 %, predominantly within the region

Glass is moving from a niche carrier material to a core building block of advanced packaging. Glass core substrates, glass interposers, through-glass vias (TGV) and glass panels for fan-out are being qualified across the industry right now — and the decisions that will define the supply chain for the next decade are being made in Taiwan, Japan and Mainland China.

This is deliberately not an operational sales role. It is not about quotations, order processing or hitting a short-term revenue quota. We are looking for someone who understands where glass-based packaging is heading technically and commercially, who can read the roadmaps of substrate makers, OSATs and foundries, and who translates that understanding into concrete business opportunities on a 12- to 36-month horizon.

The role sits at the interface between the market and the company: feeding technical market intelligence into our product and technology strategy, while opening doors to the decision-makers who matter across the regional glass and packaging ecosystem.

• Identify and assess new applications, customer segments and business models for glass in advanced packaging — glass core substrates, interposers, TGV-based structures, glass carriers, panel-level processing and photonic/optical integration

• Develop market entry and growth strategies for Taiwan, Japan and Mainland China, accounting for the distinct dynamics of each market

• Build and qualify a pipeline of strategic opportunities; hand off qualified projects to sales and application engineering

• Prepare business cases, feasibility assessments and management decision papers

• Track technology developments across the glass value chain: TGV formation and laser processing, metallization and RDL on glass, warpage and CTE management, thin-glass handling, hybrid bonding on glass, panel-level formats (510 × 515 mm and beyond)

• Monitor how glass competes with and complements organic substrates, silicon interposers and ABF build-up technology — including the cost-per-area and yield arguments that will decide adoption

• Analyse competitor and capacity movements: qualification announcements, capex, new lines at substrate makers and OSATs, joint ventures and M&A

• Assess regulatory and geopolitical conditions — export controls, localisation requirements, national funding programmes — and their impact on the regional supply chain

• Deliver structured market reports and roadmap reviews to executive management, product management and R&D

• Build and maintain relationships with decision-makers and senior technologists at substrate manufacturers, OSATs, foundries, IDMs, panel and PCB makers, and equipment suppliers across the region

• Develop joint development agreements, co-qualification programmes and ecosystem partnerships — glass adoption is a multi-party effort and depends on aligning several players at once

• Engage with research institutes, consortia and industry bodies in the region (ITRI, AIST, university clusters, SEMI working groups on glass substrates and panel-level packaging)

• Represent the company at leading trade shows and technical conferences (SEMICON Taiwan / Japan / China, ECTC, IMAPS, IWLPC, IEDM)

• Work closely with product management, R&D and application engineering to feed market requirements back into the technology roadmap

• Support regional sales teams with market knowledge, customer access and strategic context

• Collaborate with business development counterparts in Europe and North America

• Degree in materials science, electrical engineering, physics, semiconductor or mechanical engineering, or a comparable field; MBA an advantage

• Minimum 7 years in the semiconductor or electronic materials industry, with several years directly related to advanced packaging, substrates or assembly & test

• Solid technical grasp of packaging processes, materials and equipment, and of the associated value chain and cost structures; hands-on familiarity with glass, substrate or interposer technology is a strong plus

• Demonstrable, active network within the East Asian packaging and substrate value chain

• Resident in Taiwan, or clear willingness and eligibility to relocate and be based there permanently

• Business-fluent Mandarin and English

• Proven experience working across borders, particularly with Japanese and Chinese business partners

• Japanese language skills — at minimum conversational, ideally business level

• Background in a strategic function: business development, corporate strategy, technical marketing or product management

• Experience bridging a Western company with regional responsibility in Asia, or the reverse

• Familiarity with market data sources such as Yole, TechInsights or TrendForce

• Strategic perspective combined with the ability to engage credibly on technical detail

• Independent, structured and self-driven — this role runs on initiative rather than direction

• Cultural fluency and diplomatic judgement, particularly across the Taiwan–Japan–China triangle

• Persuasive at C-level and with development engineers alike

• Real influence in one of the most consequential material transitions in semiconductor packaging

• Direct visibility and short reporting lines to executive management

• Competitive package with a strategy-linked variable component

• Flexible working arrangements with a regional base in Taiwan