Responsibilities:
- Execute thermal design and simulation for high-speed networking components, focusing on Co-Packaged Optics (CPO) and ASIC-optics integration within high power density environments.
- Lead the end-to-end development of thermal solutions, including direct liquid cooling (DLC), cold plates, CDU, and heat exchangers
- Use CFD tools (FloTherm or Macroflow) to perform rack and system-level thermal/fluid analysis (flow distribution, pressure drop, and temperature profiling)
- Design thermal components using 3D CAD (Creo or SolidWorks) to support seamless hardware integration
- Execute thermal, liquid, and acoustic validation testing; lead root cause analysis (RCA) for flow or thermal issues and implement corrective designs
- Collaborate with ME/EE/Reliability and global vendors to align thermal architectures with total system design and international standards
Basic Requirements:
- Bachelor's or Master's Degree in Mechanical/Thermal Engineering and 8+ years total experience in product design (Server, Networking switch)
- Proven experience in the thermal management of high-power ASICs and advanced packaging, with specific exposure to CPO or Silicon Photonics
- 3+ years of specific experience in rack-scale thermal design
- Hands-on experience with heat pipes, vapor chambers, fans, and liquid cooling components
- Proficiency in CFD simulation and 3D modeling software
- Excellent English communication skills (verbal and written) with strong technical leadership capabilities
Desirable Requirements:
- Self-motivated and proactive
- Fluent in English language (verbal and written)
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